Non-Toxic Gold Wafer Electroplating Process for Semiconductor Applications

Stable gold plating for advanced semiconductor applications; Elevate^® Gold 7990 NBV demonstrates slightly acidic pH.

7 microns thickness demonstrating excellent pattern retention.

Good sidewall and bottom via plating.

30 microns of gold with no plating under photoresist.

"Silicon semiconductors, compound semiconductors, glass substrates and other advanced substrates all benefit from the use of products formulated by Technic Inc. Our easy-to-control processes provide a performance advantage over the industry standards. Our highly trained Research and Development teams in the U.S., Europe and Asia are constantly working to stay ahead of the status quo and offer proprietary products that provide our customers with a distinct advantage.

Technic continues to invest in new facilities and talented staff members, most recently adding Applications Labs in China, Taiwan and Singapore. When you partner with Technic you will be connecting with a global organization that puts customer service first. Whether you contact us by phone, email or WeChat we are always available to take care of your needs."

- Anthony Gallegos, Global Semiconductor Product Manager

For 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

About Technic

Technic's industry-leading Elevate^® Gold 7990 NBV is a cyanide-free, electrolytic sulfite gold process designed specifically for semiconductor applications. The process produces pure, soft bright gold deosits from a slightly acidic solution without the use of harmful toxic metallic grain refiners such as thallium and arsenic.  

Greater Versatility

Elevate® Gold 7990 NBV has become the process of choice in a wide range of semiconductor applications including, but not limited to RDL, blanket deposits, pattern plating, conformal via plating, and thick gold bumping.

Exceptional Stability

• Thickness ranging from <1 to 100 microns

While typical sulfite gold baths run at a pH of approximately 9.0, Technic's proprietary stabilizer allows for maximum bath stability with an atypical, slightly acidic, optimum pH of 6.35.

• Process of choice for a wide-range of applications

• Extremely compatible with almost all photoresist

• Bright deposits without the use of toxic metallic grain refiners

• Smooth grain structure

• Excellent step coverage

• Extended bath life

The process can be used for plating several different applications without major modifications to the solution and can be used on a variety of different tool sets.   

This lower pH provides the following benefits:

Stable gold plating bath free of arsenic, thallium, and other harsh grain refiners.